REFLOW SOLDERING CONDITIONS
1. A thermal condition system such as infrared radiation (IR) or hot blast shall be adopted, and vapor heat transfer systems (VPS) are not recommended.
2. Reflow shall be done within 2 cycles. Please make sure that the parts have enough cooling time.
3. － The time of preheating from 150℃ to 200℃ shall be within 180 seconds maximum;
－ The time of soldering temperature at 217℃ measured on capacitors’ top shall not exceed tL (second);
－ The peak temperature on capacitors’ top shall not exceed Tp(℃), and the time within 5℃ of actual peak temperature shall not exceed tp (second).
● Classification Reflow Profile
*1. Average ramp-up rate is 3℃/second max.
*2. Ramp-down rate is 6℃/second max.
*3 Time from 25℃ to peak temperature is 8 minutes max.
● Classified at Temperature and Time for All Products
|
Size |
Thickness (㎜) |
Volume (㎜3) |
Tp (℃) |
t L(second) |
tp(second) |
|
Φ4～Φ6.3 & Φ8×6.2L |
≥2.5 |
< 350 |
250±0 |
90 |
40 |
|
Φ8×10.5L |
≥2.5 |
350～2000 |
240±0 |
90 |
30 |
|
Φ10×10.5L / 13.5L |
≥2.5 |
350～2000 |
235±0 |
60 |
30 |
|
Φ12.5 & Φ16 |
≥2.5 |
> 2000 |
230±0 |
30 (20)※ |
20 |
Refer to Table 4-2, 5-2 and Figure 5-1, IPC/JEDEC J-STD-020C
Re: (20)※ is special for mid-to-high voltage V-chip capacitors which is HU series made by KJ.
● Classified at Temperature and Time Only for Standard Size without ( )
|
Size |
Thickness (㎜) |
Volume (㎜3) |
Tp (℃) |
t L(second) |
tp(second) |
|
Φ4～Φ6.3 & Φ8×6.2L |
≥2.5 |
< 350 |
260±0 |
90 |
5 |
|
Φ8×10.5L |
≥2.5 |
350～2000 |
260±0 |
90 |
5 |
|
Φ10×10.5L / 13.5L |
≥2.5 |
350～2000 |
260±0 |
60 |
5 |
